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Dr. Byoung-Hee You, Ph.D.

Dr. You

Assistant Professor

EDUCATION

Ph. D. Dec. 2008

Department of Mechanical Engineering (Minor: Electrical Engineering),                                         

Louisiana State University (LSU), Baton Rouge, LA, USA

Dissertation: Microassembly Technology for Modular, Polymer Microfluidic Devices

Advisor: Dr. Michael C. Murphy

M. S.  Feb. 1996

            Department of Mechanical Engineering,

            Yeungnam University, Kyongsan, Republic of Korea

Thesis: A Study on an Automatic Seam Tracking System for Sheet Metal Arc Welding

Advisor: Dr. J. W. Kim

B. S.   Feb. 1994

            Department of Mechanical Engineering,

            Yeungnam University, Kyongsan, Republic of Korea

 

RESEARCH Interests

Postdoctoral Research Associate, Feb. 2009 – Aug. 2009,

Center for Bio-Modular Multi-Scale Systems and Department of Mechanical Engineering, Louisiana State University, Baton Rouge, LA, USA (Sponsor: National Science Foundation (NSF))

Supervised a group of graduate and undergraduate students for the design, fabrication, and characterization of biomedical microsystems and a large area micromolding technology for high throughput biomedical applications

Worked on micro molding using hot embossing for single-side and double-side polymer parts

Involved in the realization of 96-well polymerase chain reaction, PCR multi-reactor platforms

Designed 6-inch large area mold insert for micro injection molding

Participated in several research projects for polymer BioMEMS applications and nanosystems

High throughput biomedical applications using double-sided  micro injection molding

Replication of reliable assembly features for modular, polymer microfluidic systems

Deposition and applications of nanoscale multilayers of invar with copper

Graduate Research Assistant, Aug. 2003 – Dec. 2008,

Department of Mechanical Engineering, Louisiana State University, Baton Rouge, LA, USA

Significant experience on design of microsystems, microassembly, and polymer microfabrication process development for the cost-effective mass production of biomedical microdevices

Investigated mechanical assembly technology using kinematic design to perform motion and kinematic constraint analyses of assembly features.

Developed precise, passive alignment of modular, polymer microdevices without additional alignment processes in microassembly.

Investigated micro injection molding technology for the replication of microdevices using simulation and experiments.

Studied thermally induced mechanical stresses of microstructures in micro injection molding and hot embossing.

Designed double-sided injection molding process and mold for the replication of modular, polymer microdevices.

Constructed assembly tolerance models to predict and control tolerance effect of components at the assembly level.

Developed micro cylindrical post array using UV and X-ray lithography, electroplated nickel for hot embossing.

Worked on a team developing modular, biomedical microdevices for cancer detection including reagent delivery, PCR/LDR devices.

In-depth knowledge on the theoretical analysis and computer simulations

Developed analytical models using MATLAB for kinematic design of assembly features and assembly tolerance analysis.

Carried out extensive computer simulations using Moldflow, HyperMesh, SolidWorks, and ANSYS for the design of microdevices.

Research Engineer, Jul. 1998 – Jul. 2001,

Regional Research Center, Yeungnam University, Kyongsan, Republic of Korea

Responsible for two sponsored research projects

Development of high performance web forming machine for dry nonwovens: Project involved design, fabrication, and testing of a variable velocity system of web carriage for precise web forming.

Development of high speed needle punching machine for dry nonwovens: Project involved modal analysis using ANSYS and kinematic analysis of an eccentric punching cam mechanism using analytical models and Working Model 2D.

Research Engineer, Mar. 1996 – Jun. 1998,

Research & Development Institute, Hyosung Industries CO., Ltd., Changwon, Republic of Korea

Significant experiences on the development of mechanical systems for factory automation from concept design to trial and errors in real industrial field

Responsible for the development of  mechanical systems for factory automation

Development of pipe and flange automatic welding system for power transmission towers: Project involved design, fabrication, and testing of the automatic welding system consisting of six-axis robots, pipe rotating system, arc and touch sensing system, welding power source, and water cooling system.

Development of muffler assembly system (EF-Sonata, Hyundai Motor Co.): Project involved design, fabrication, and testing of the assembly system consisting of hydraulic cylinders and pumps, spot welding power source, welding gun, and moving carriages.

 TECHNIQUES

Broad knowledge and experience in microdevice fabrication techniques

More than seven years of hands-on microfabrication experiences, Injection Molding, Hot Embossing, Standard Photolithography, X-ray Lithography, X-ray mask fabrication, Optical mask fabrication by Pattern Generator, Thin Film Deposition (Cr, Au, and Ti) by Sputtering and E-beam, Evaporation, Plasma Asher, Electroplating (Cu, Ni, and Au), Wet Chemical Process (metal wet etch), and Mechanical lapping.

Broad knowledge and experience in manufacturing systems including factory automation systems and textile machinery

Industrial field experiences in the development of automatic mechanical systems using vision, laser displacement, and electromagnetic sensors, data acquisition system, arc and spot welding machinery, actuators, and industrial robots

Device Characterization Techniques

Experienced user of Scanning Electron Microscopy (SEM), Profilometry, and Optical Microscopy.

Simulation /Design Software

ANSYS, Moldflow, Working Model 2D, MATLAB, AutoCAD, SolidWorks, CADRA, and HyperMesh


MEMBERSHIP

Member of the American Society of Mechanical Engineers (ASME)

U.S. PATENT

  M. C. Murphy, Byoung Hee You, P.-C. Chen, T. Y. Lee, D. S. Park, “Polymer passive alignment structures for modular microfluidics,” June 7, 2007, OIP No. 0714 (Patent disclosure).

A LIST OF PUBLICATIONS AND PRESENTATIONS

REFFERED JOURNALS

Byoung Hee You, D. S. Park, P.-C. Chen, S. G. Park, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “Passive micro-assembly of modular, hot embossed, polymer microfluidic deveices using exact constraint design”, Journal of Micromechanics and Microengineering, vol. 19, no. 12, 2009, doi:10.1088/0960-1317/19/12/125025.

 

D. S. Park, M. L. Hupert, M. A. Witek, Byoung Hee You, P. Datta, J. Guy, J.-B. Lee, S. A. Soper, D. E. Nikitopoulos, and M. C. Murphy, “A titer plate-based polymer microfluidic platform for high throughput nucleic acid purification,” Biomedical Microdevices, vol. 10, no. 1, pp. 21-33, 2008.

 

Z. Song, Byoung Hee You, J. Lee, and S. Park, “Study on demolding temperature in thermal imprint lithography via finite element analysis,” Microsystem Technologies, vol. 14, no. 9-11, pp. 1593-1597, 2008.

 

Z. Song, J. Choi, Byoung Hee You, J. Lee, and S. Park, “Simulation study on stress and deformation of polymeric patterns during the demolding process in thermal imprint lithography,” Journal of Vacuum Science & Technology, Part B vol. 26, no. 2, pp. 598-605, 2008.

 

S. S. Kweon, B. O. Kim, Byoung Hee You, and D. H. Chun, “Analysis of dynamic characteristics for jet loom frame through the theoretical study,” Journal of Korean Fiber Society, vol. 40, no. 2, pp. 123-127, 2003.

 

Byoung Hee You and J.-W. Kim, “A study on an automatic seam tracking system by using an electromagnetic sensor for sheet metal arc welding of butt joints,” Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, vol. 216, no. 6, pp. 911-920, 2002.

 

CONFERENCE PUBLICATIONS AND PRESENTATIONS

P.-C. Chen, D. S. Park, Byoung Hee You, N. Kim, T. Park, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “A high throughput microfluidic thermal reactor,” the 2009 ASME International Mechanical Engineering Congress & Exposition (IMECE), Lake Buena Vista, FL, USA, Nov. 13-19, 2009.

 

D. S. Park, V. Singh, Byoung Hee You, N. Kim, P.-C. Chen, S. A. Soper, D. E. Nikitopoulos, J. Goettert, and M. C. Murphy, “Control of internal stress for high quality nickel large area mold inserts,” the 2009 ASME International Mechanical Engineering Congress & Exposition (IMECE), Lake Buena Vista, FL, USA, Nov. 13-19, 2009.

 

P.-C. Chen, D. S. Park, Byoung Hee You, N. Kim, T. Park, S. A. Soper, D. E. Nikitopoulos, and M. C. Murphy, “A disposable high throughput micro-fluidic thermal reactor,” 2009 Proceedings of the 13th International conference on Miniaturized System for Chemistry and Life sciences, Jeju, Republic of Korea, Oct. 1-5.

 

Byoung Hee You, D. S. Park, P.-C. Chen, S. D. Rani, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “Assembly tolerance analysis for injection molded modular, polymer microfluidic devices,” 2008 Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Boston, MA, USA, Oct. 31-Nov. 6, IMECE2008-68143.

 

P.-C. Chen, D. S. Park, Byoung Hee You, N. Kim, T. Park, Y. Desta, S. Park, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “A thermal system for high throughput continuous flow polymerase chain reaction device (CFPCR),” 2008 Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Boston, MA, USA, Oct. 31-Nov. 6, IMECE2008-68975.

 

P.-C. Chen, D. S. Park, Byoung Hee You, N. Kim, T. Park, P. Datta, Y. Desta, S. Park, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “Design and performance of a rapid, nanoliter, continuous flow polymerase chain reactor for a high throughput microsystem,” 2008 Proceedings of the 12th International conference on Miniaturized System for Chemistry and Life sciences, San Diego, CA, USA, Oct. 12-16, MicroTAS_0906.

 

D. S. Park, P.-C. Chen, Byoung Hee You, N. Kim, T. Park, T. Y. Lee, P. Datta, Y. Desta, S. A. Soper, D. E. Nikitopoulos, and M. C. Murphy, “Small footprint continuous flow PCR devices for a 96-well CFPCR multireactor platform,” Hilton Head 2008: A Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head Island, SC, USA, June 1-5.

 

D. S. Park, P.-C. Chen, Byoung Hee You, N. Kim, T. Park, P. Datta, Y. Desta, S. A. Soper, D. E. Nikitopoulos, and M. C. Murphy, “Optimization of the geometry for continuous flow PCR devices in a titer plate-based PCR multi-reactor platform,” 2007 Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Seattle, WA, USA, Nov. 11-15, IMECE2007-42315.

 

P.-C. Chen, Byoung Hee You, D. S. Park, S. Park, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “Replication of reliable assembly features for polymer modular microfluidic systems,” 2007 Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Seattle, WA, USA, Nov. 11-15, IMECE2007-42206.

 

Byoung Hee You, D. S. Park, P.-C. Chen, W. M. Caceres, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “Dimensional and locational integrity in the replication of polymeric microdevices,” Proceedings of ASME InterPACK 2007, Vancouver, BC, Canada, July 8-12, IPACK2007-33482.

 

D. S. Park, M. L. Hupert, M. Witek, J. Guy, P. Datta, Byoung Hee You, S.  A. Soper, and M. C. Murphy, “A 96-well SPRI reactor in a photo-activated polycarbonate (PPC) microfluidic chip,” Proceedings of MEMS 2007 20th IEEE International Conference on Micro Electro Mechanical Systems, pp. 433-436, Kobe, Japan, Jan. 21-25, 2007.

 

D. S. Park, M. Hupert, J. Guy, P. Datta, J.-B. Lee, M. Witek, Byoung Hee You, S. A. Soper,                    D. E. Nikitopoulos, and M. C. Murphy, “Microtiter plate-based microfluidic platforms: sealing, leakage testing, and performance of a 96-well SPRI device,” 2006 Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Chicago, IL, USA, Nov. 5-10, IMECE2006-15275.

 

Byoung Hee You, P.-C. Chen, J. Guy, P. Datta, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “Passive alignment structures in modular, polymer microfluidic devices,” 2006 Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Chicago, IL, USA, Nov. 5-10, IMECE2006-16100.

 

Byoung Hee You, D. S. Park, C. W. Mock, W. M. Caceres, D. E. Nikitopoulos, S. A. Soper, and M. C. Murphy, “Tolerance variation and passive alignment in modular, polymer microfluidic devices,” 2006 Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Chicago, IL, USA, Nov. 5-10, IMECE2006-15258.

 

J. S. Bok, Byoung Hee You, D. H. Chen, and C. H. Joo, “A study on kinematic analysis of eccentric cam of needle punching machine,” Proceedings of the Korean Fiber Society, Kwangju, South Korea, Oct. 29-30, 1999, pp. 98-101, 1999.

 

Byoung Hee You and J.-W. Kim, “A Study on an automatic seam tracking system by using an Electromagnetic sensor for sheet metal arc welding of butt joints,” Proceedings of the Taiwan International Welding Conference '98, Taipei, Taiwan, Sep. 7,1998.

 

GOVERNMENT REPORTS

S. Y. Park, H. K., Kim, C. D. Kim, B. S. Kim, J. G. Seo, J. S. Bok, H. D. Kim, D. H. Chen, and Byoung Hee You, “Development of rapier loom for prototype fabrics,” Ministry of Commerce, Industry and Energy, 2000, Korean Government Report.

 

J. H. Lee, J. K., Park, j. G. Hwang, J. H. Lee, H. T. Kim, J. C. Kim, D. H. Chen, Byoung  Hee You, H. G. Kim, and H. J. Jang, “Development of high performance web forming machine for dry non wovens,” Ministry of Commerce, Industry and Energy, 1999, Korean Government Report.

 

INVITED TALKS AND PRESENTATIONS

“Microassembly technology for modular, polymer microdevices and applications,” 2008, Yeungnam University, Korea, Oct. 08.

 

“Polymer microfabrication for biomedical microdevices,” 2008, Bio-Rad laboratories, Hercules, CA, USA, Sep. 08.

 

“Microassembly technology for modular, polymer microdevices,” 2006, Korea Institute of Machinery & Materials (KIMM), Korea, Jan. 10.

 

“Micro injection molding and microassembly technology for modular, polymer microdevices,” 2006, Samsung Advanced Institute of Technology (SAIT), Korea, Jan. 04.